engineered materials solutions
Thermal Management Materials
All of our thermal-management materials have been engineered to provide an effective thermally conductive interface between heat sinks and the electronic devices they are mated to, while providing the dielectric strength needed to ensure durability. Applications include an interface between a CPU, transistor, power supply, or other heat-generating component and a heat sink or rail. Our materials provide engineers with a clean and efficient alternative to mica, ceramics, or grease for a wide range of electronic applications. All of these materials can be cut to any custom shape that meets your specifications, and we can apply an adhesive with a peel-away liner to most products.
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These products can be used for low-cost thermal transfer, requiring minimal thickness and high physical and mechanical characteristics. The fiberglass/silicone-compound construction provides excellent cut-through resistance, thermal transfer and electrical isolation. These products generally require higher pressures to perform effectively. Thicknesses range from 0.007” to 0.018” to fill the need of the varying gap requirements. Thermal conductivity (W/mK) ranges from 0.9 to 2.0 and thermal impedance (°C in.2/W) ranges from 0.18 to 0.71. All of these materials are UL94V-0 recognized.
These products can be used to fill gaps and enhance thermal performance of the electrical system. Gap fillers can accommodate materials of different coefficients of thermal expansion with the compliant interface. This family of products comes in a variety of hardnesses and thicknesses to effectively close gaps while providing the thermal transfer needed in demanding electronic applications. Thicknesses range from 0.015” to 0.250” and hardnesses (Shore A) from 4 to 65. Thermal conductivity (W/mK) in this family of products is 1.3 to 3.0 and thermal impedance (°C in.2/W) ranges from 1.10 to 1.25. Most of these materials are UL94V-0 recognized. We also have a thermally conductive sponge material whose thermal conductivity (W/mK) ranges from 0.3 to 0.65 and comes in thicknesses of 0.031” to 0.25”.
These products can be used in place of mechanical fasteners, provide excellent thermal coupling between components and heat sinks, and can accommodate materials of different coefficients of thermal expansion with the compliant interface. All of the adhesives are flame retardant and are formulated for high-performance adhesion while still being easily re-workable without damage to sensitive components. These products range in thickness from 0.003” to 0.011”. Thermal conductivity ranges (W/mK) from 0.4 to 2.6 and thermal impedance (°C in.2/W) ranges from 0.10 to 0.50. Some of these products are not electrically insulative.
These products can be used in place of messy thermal greases, provide excellent thermal coupling between components and heat sinks, and can alleviate all the problems associated with thermal greases, such as migration, pump-out and uneven bond line. The thermal impedance of these phase- change products is comparable with that of thermal grease. The materials are designed to provide either bond-line adhesion or lack of it for ease of rework. Thickness ranges from 0.003” to 0.004”. Thermal conductivity (W/mK) ranges from 0.6 to 1.0 and thermal impedance (°C in.2/W) ranges from 0.03 to 0.13.